Performance of molding materials and interconnections integrated in interposers dedicated to RF or microwave 3DIC applications

With the tremendous development of wireless applications, new communication systems are emerging in the 3DIC microelectronic manufacturing. Many of them integrate the interposer technology in order to efficiently associate heterogeneous devices such as transceivers and antennas. Those devices are electrically connected by means of interconnections achieved within an interposer platform which constitutes a complex environment to propagate high frequency signals. Integrity may be degraded by silicon losses and molding material recently developed. Regarding the development cost of these new processes, it becomes necessary to analyze, evaluate and predict, over a wide band of frequency (up to 67GHz), the performance of interconnections and molding material integrated in 3D packaging with interposers.