Glass interposer with high-density three-dimensional structured TGV for 3D system integration

Author

Nukaga, Osamu ; Shioiri, Tetsu ; Yamamoto, Seiichi ; Suemasu, Takashi

Author_Institution

Opt. & Electron. Lab., Fujikura Ltd., Sakura, Japan

fYear

2013

fDate

2-4 Oct. 2013

Firstpage

1

Lastpage

4

Abstract

An epoch-making glass interposer having high-density three-dimensional structured through glass via (TGV) was proposed and demonstrated. By using femtosecond laser-assisted etching and plating, TGVs including bent (crank-shaped) portions were successfully fabricated inside single silica substrate. The diameter of the TGV was 15 μm and the length was 2 mm, respectively. Therefore the aspect ratio becomes 130 approximately. The pitch between the neighbor TGVs was 40 μm. Since an arbitrary interconnects can be achieved by the interposer, higher performance and more design freedom three-dimensional (3D) system integration can be expected.

Keywords

glass; integrated circuit interconnections; laser beam etching; silicon compounds; three-dimensional integrated circuits; 3D system integration; SiO₂; aspect ratio; bent shaped portion; crank shaped portion; epoch making glass interposer; femtosecond laser assisted etching; femtosecond laser assisted plating; high density through glass via; size 15 mum; size 2 mm; three dimensional structured TGV; Etching; Glass; Lasers; Resistance; Substrates; Three-dimensional displays; Zinc oxide; 3D structured through glass via; femtosecond laser-assisted etching; glass interposer;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2013 IEEE International

Conference_Location

San Francisco, CA

Type

conf

DOI

10.1109/3DIC.2013.6702321

Filename

6702321