DocumentCode
667981
Title
3D cache hierarchy optimization
Author
Yavits, Leonid ; Morad, Amir ; Ginosar, Ran
Author_Institution
Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
fYear
2013
fDate
2-4 Oct. 2013
Firstpage
1
Lastpage
5
Abstract
3D integration has the potential to improve the scalability and performance of Chip Multiprocessors (CMP). A closed form analytical solution for optimizing 3D CMP cache hierarchy is developed. It allows optimal partitioning of the cache hierarchy levels into 3D silicon layers and optimal allocation of area among cache hierarchy levels under constrained area and power budgets. The optimization framework is extended by incorporating the impact of multithreaded data sharing on the private cache miss rate. An analytical model for cache access time as a function of cache size and a number of 3D partitions is proposed and verified using CACTI simulation.
Keywords
cache storage; circuit optimisation; elemental semiconductors; integrated circuit modelling; microprocessor chips; silicon; three-dimensional integrated circuits; 3D CMP cache hierarchy optimization; 3D integration; 3D silicon layers; CACTI simulation; cache hierarchy levels; cache size; chip multiprocessors; multithreaded data sharing; optimal partitioning; power budgets; Analytical models; Delays; Integrated circuit modeling; Optimization; Resource management; Silicon; Three-dimensional displays; 3D integration; Analytical Performance Models; Cache Hierarchy; Chip Multiprocessor; Resource Allocation Optimization;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2013 IEEE International
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/3DIC.2013.6702346
Filename
6702346
Link To Document