• DocumentCode
    667981
  • Title

    3D cache hierarchy optimization

  • Author

    Yavits, Leonid ; Morad, Amir ; Ginosar, Ran

  • Author_Institution
    Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
  • fYear
    2013
  • fDate
    2-4 Oct. 2013
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    3D integration has the potential to improve the scalability and performance of Chip Multiprocessors (CMP). A closed form analytical solution for optimizing 3D CMP cache hierarchy is developed. It allows optimal partitioning of the cache hierarchy levels into 3D silicon layers and optimal allocation of area among cache hierarchy levels under constrained area and power budgets. The optimization framework is extended by incorporating the impact of multithreaded data sharing on the private cache miss rate. An analytical model for cache access time as a function of cache size and a number of 3D partitions is proposed and verified using CACTI simulation.
  • Keywords
    cache storage; circuit optimisation; elemental semiconductors; integrated circuit modelling; microprocessor chips; silicon; three-dimensional integrated circuits; 3D CMP cache hierarchy optimization; 3D integration; 3D silicon layers; CACTI simulation; cache hierarchy levels; cache size; chip multiprocessors; multithreaded data sharing; optimal partitioning; power budgets; Analytical models; Delays; Integrated circuit modeling; Optimization; Resource management; Silicon; Three-dimensional displays; 3D integration; Analytical Performance Models; Cache Hierarchy; Chip Multiprocessor; Resource Allocation Optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2013 IEEE International
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/3DIC.2013.6702346
  • Filename
    6702346