DocumentCode
673392
Title
Measurement method for the TE mode cutoff frequency in EBG structures fabricated in LTCC for antenna applications
Author
McKinzie, William E. ; Nair, Darsana M. ; Thrasher, Bradley A. ; Smith, Michael A. ; Hughes, Elizabeth D. ; Parisi, James M.
Author_Institution
WEMTEC, Inc., Fulton, MD, USA
fYear
2013
fDate
7-13 July 2013
Firstpage
85
Lastpage
86
Abstract
This paper presents characterization of low temperature co-fired ceramic (LTCC) based electromagnetic bandgap (EBG) structures. We show a new test method to measure the TE mode cutoff frequency of an EBG structure. This test method is implemented at millimeter wave frequencies. Exponentially-shaped TE mode surface wave launchers are fabricated in the same LTCC substrate as the EBG structure under test to realize a compact and repeatable test vehicle. A pair of two port coupling measurements experimentally yields the TE mode cutoff frequency, below which a bound TE mode surface wave is suppressed. The TE mode cutoff frequency is important where EBG structures are integrated into millimeterwave LTCC antennas because this cutoff frequency must be greater than the antenna´s operational frequency range. This proposed test method differs from previous experimental techniques because it employs a calibration test vehicle, and this test method provides a clear indication of the TE mode cutoff frequency.
Keywords
ceramics; electromagnetic launchers; frequency measurement; millimetre wave antennas; photonic band gap; substrates; EBG structures; LTCC substrate; TE mode cutoff frequency measurement method; TE mode surface wave launchers; antenna applications; compact test vehicle; electromagnetic bandgap structures; low temperature co-fired ceramic; millimeter wave frequencies; port coupling measurements; repeatable test vehicle; Couplings; Cutoff frequency; Metamaterials; Periodic structures; Surface impedance; Surface waves; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium (APSURSI), 2013 IEEE
Conference_Location
Orlando, FL
ISSN
1522-3965
Print_ISBN
978-1-4673-5315-1
Type
conf
DOI
10.1109/APS.2013.6710703
Filename
6710703
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