• DocumentCode
    673438
  • Title

    A 10∶1 bandwidth textile-based conformal spiral antenna with integrated planar balun

  • Author

    Zheyu Wang ; Lee, Lanlin Z. ; Volakis, J.L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Ohio State Univ., Columbus, OH, USA
  • fYear
    2013
  • fDate
    7-13 July 2013
  • Firstpage
    220
  • Lastpage
    221
  • Abstract
    We present a novel wideband conformal slot spiral based on embroidered electrically conductive fibers (e-fibers). Such e-fibers are composed of high strength and flexible Zylon core covered with a 2~3 μm metallic coating. Using these e-fibers, highly conductive textile surfaces were precisely fabricated using computerized embroidery machinery. A unique aspect of the proposed conductive textiles is their inherent mechanical flexibility over traditional metals, in addition to their low electrical loss. A textile-based slot spiral was fabricated and shown to achieve a 10:1 bandwidth from 300 to 3000 MHz with near consistent circularly polarized gain of 5 dBi over the band. Such performance has never before been achieved using textile antennas, and/or flexible surfaces. As such, software radios and wideband beamforming can be achieved using antennas woven into clothing or embroidered into non-planar surfaces of any shape and detail.
  • Keywords
    baluns; coatings; fibres; spiral antennas; textiles; bandwidth textile-based conformal spiral antenna; clothing; computerized embroidery machinery; conductive textile surfaces; e-fibers; embroidered electrically conductive fibers; flexible Zylon core; frequency 300 MHz to 3000 MHz; integrated planar balun; mechanical flexibility; metallic coating; nonplanar surfaces; software radios; textile-based slot spiral; wideband beamforming; wideband conformal slot spiral; Broadband antennas; Impedance matching; Radio frequency; Spirals; Textiles; Wideband;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium (APSURSI), 2013 IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    1522-3965
  • Print_ISBN
    978-1-4673-5315-1
  • Type

    conf

  • DOI
    10.1109/APS.2013.6710771
  • Filename
    6710771