Packaged integrated transceiver for short-range high data-rate communications at 60 GHz

A 60-GHz folded dipole antenna integrated with a transceiver on a 65-nm CMOS-SOI chip for short range and low power wireless communications is presented. The chip is packaged in a QFN48L pre-molded cavity package with removable lid. Radiating patch elements coupled to the on-chip folded dipole and surrounded by metallic via walls are fabricated under the package lid to improve the radiation performances. The experimental radiation patterns and gain values show an excellent agreement with the simulations. An antenna gain up to 3.7-5.2 dBi at 60 GHz is demonstrated.