• DocumentCode
    682533
  • Title

    Lead/Lead Free solder joints comparative shear tests function of working temperature and soldering thermal profile

  • Author

    Plotog, I. ; Varzaru, Gaudentiu ; Mihailescu, Bogdan ; Branzei, Mihai ; Bibis, Adrian ; Cristea, Ionut

  • Author_Institution
    Centre for Technol. Electron. & Interconnection Tech., Politeh. Univ. of Bucharest (UPB-CETTI), Bucharest, Romania
  • fYear
    2013
  • fDate
    24-27 Oct. 2013
  • Firstpage
    283
  • Lastpage
    286
  • Abstract
    The domains exempted by the RoHS EU Directive, as aerospace, where Sn63Pb37 eutectic solder alloy with low silver content addition are used, are characterized by a large range of working temperatures and high mechanical stress level. In the paper, the mechanical strength of solder joints produced using Lead and Lead-Free solder pastes into Vapor Phase Soldering processes characterized by different cooling rates, were benchmarked by temperature in respect to the concept of "Homologous temperature". The experiments were done by measuring the solder joints shear forces and keeping the surface of test boards at temperatures up to 398.15 K (125°C). The experiments results consist in qualitative/quantitative light microscopy analyses and values of solder joints shear forces. The results offer the possibility to create a data base useful to define a methodology for future qualification of lead-free solder alloys according to the RoHS EU Directive.
  • Keywords
    RoHS compliance; cooling; eutectic alloys; lead alloys; materials testing; solders; tin alloys; RoHS EU Directive; Sn63Pb37; comparative shear tests function; different cooling rates; eutectic solder alloy; homologous temperature; lead free solder joints; leaded solder joints; mechanical strength; soldering thermal profile; temperature 398.15 K; vapor phase soldering processes; working temperature; Cooling; Lead; Soldering; Temperature; Temperature dependence; Temperature measurement; Solder joints mechanical stress; Vapor Phase Soldering (VPS); homologous temperature (TH);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
  • Conference_Location
    Galati
  • Type

    conf

  • DOI
    10.1109/SIITME.2013.6743691
  • Filename
    6743691