DocumentCode
683846
Title
Silver nanoparticles embedded in dielectric matrix: Charge transport analysis with application to control of space charge formation
Author
Makasheva, Kremena ; Villeneuve-Faure, C. ; Roy, S. ; Despax, Bernard ; Boudou, Laurent ; Laurent, C. ; Teyssedre, Gilbert
Author_Institution
Lab. Plasma et Conversion d´Energie, Univ. de Toulouse, Toulouse, France
fYear
2013
fDate
20-23 Oct. 2013
Firstpage
238
Lastpage
241
Abstract
This work presents a study on the charge injection and control of dielectric charging phenomenon in thin dielectric layers with tailored interfaces. Single layer of silver nanoparticles (Ag-NPs) was deposited on thermally grown SiO2 layer and covered with plasma deposited thin organosilicon SiCO:H layer. Thus, the Ag-NPs layer can be located at different distances from the surface with Ag-NPs representing artificial deep traps for the charges injected from the surface. The space-charge diagnostic was performed by Kelvin Force Microscopy (KFM) - a diagnostic method derivative from Atomic Force Microscopy (AFM) and giving the possibility to probe the surface potential and the quantity of charges injected previously by an AFM tip under bias voltage. The obtained results reveal that presence of Ag-NPs close to the dielectric surface significantly modifies the electric field distribution; thus a single layer of Ag-NPs can efficiently be used to block the electrical charge injection in thin dielectric layers.
Keywords
nanoparticles; plasma deposition; silicon compounds; space charge; surface potential; AFM; Ag; KFM; Kelvin force microscopy; SiCO:H; SiO2; atomic force microscopy; charge transport analysis; dielectric matrix; electric field distribution; plasma deposited thin organosilicon; silver nanoparticles; space charge formation control; surface potential; thin dielectric layers; Dielectrics; Electrodes; Plasmas; Polymers; Silicon; Space charge; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location
Shenzhen
Type
conf
DOI
10.1109/CEIDP.2013.6747079
Filename
6747079
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