• DocumentCode
    683846
  • Title

    Silver nanoparticles embedded in dielectric matrix: Charge transport analysis with application to control of space charge formation

  • Author

    Makasheva, Kremena ; Villeneuve-Faure, C. ; Roy, S. ; Despax, Bernard ; Boudou, Laurent ; Laurent, C. ; Teyssedre, Gilbert

  • Author_Institution
    Lab. Plasma et Conversion d´Energie, Univ. de Toulouse, Toulouse, France
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    238
  • Lastpage
    241
  • Abstract
    This work presents a study on the charge injection and control of dielectric charging phenomenon in thin dielectric layers with tailored interfaces. Single layer of silver nanoparticles (Ag-NPs) was deposited on thermally grown SiO2 layer and covered with plasma deposited thin organosilicon SiCO:H layer. Thus, the Ag-NPs layer can be located at different distances from the surface with Ag-NPs representing artificial deep traps for the charges injected from the surface. The space-charge diagnostic was performed by Kelvin Force Microscopy (KFM) - a diagnostic method derivative from Atomic Force Microscopy (AFM) and giving the possibility to probe the surface potential and the quantity of charges injected previously by an AFM tip under bias voltage. The obtained results reveal that presence of Ag-NPs close to the dielectric surface significantly modifies the electric field distribution; thus a single layer of Ag-NPs can efficiently be used to block the electrical charge injection in thin dielectric layers.
  • Keywords
    nanoparticles; plasma deposition; silicon compounds; space charge; surface potential; AFM; Ag; KFM; Kelvin force microscopy; SiCO:H; SiO2; atomic force microscopy; charge transport analysis; dielectric matrix; electric field distribution; plasma deposited thin organosilicon; silver nanoparticles; space charge formation control; surface potential; thin dielectric layers; Dielectrics; Electrodes; Plasmas; Polymers; Silicon; Space charge; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6747079
  • Filename
    6747079