• DocumentCode
    683859
  • Title

    Partial discharge and breakdown behavior of enamel-insulated copper conductors in carbon powder

  • Author

    Taylor, Daniel J. ; Hiziroglu, Huseyin R. ; Foss, Peter H.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Kettering Univ., Flint, MI, USA
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    959
  • Lastpage
    962
  • Abstract
    It is clear that during the manufacturing of the windings of an electric motor, enamel-insulated copper conductors are subjected to mechanical strain. The electrical performance of the enamel insulation could be adversely affected by this mechanical strain. Partial discharge inception voltage (PDIV) is a useful tool for comparing the performance of insulations. Therefore, PDIV tests along with breakdown voltage tests were performed for evaluating the effect of different levels of tensile-strain on the electrical properties of the enamel insulation of the copper conductor. In a previous work the enamel insulation was tested between two parallel-plate electrodes. In this study, however, unstrained and tensile-strained, enamel-insulated, copper conductors with rectangular cross-section were investigated and compared for their breakdown voltages and partial discharge behavior in a carbon powder medium.
  • Keywords
    carbon; conductors (electric); copper; electrodes; enamels; partial discharges; powders; PDIV tests; breakdown behavior; breakdown voltage tests; carbon powder; carbon powder medium; electric motor windings; electrical performance; electrical property; enamel-insulated copper conductors; mechanical strain; parallel-plate electrodes; partial discharge behavior; partial discharge inception voltage; rectangular cross-section; tensile-strain; tensile-strained copper conductors; Carbon; Electrodes; Insulation; Partial discharges; Powders; Voltage measurement; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6747098
  • Filename
    6747098