DocumentCode
687100
Title
Total ionization damage effects in double silicon-on-Insulator devices
Author
Honda, Shogo ; Hara, Kentaro ; Asano, Masahiro ; Maeda, T. ; Tobita, N. ; Arai, Yutaro ; Miyoshi, Takanori ; Ohno, M. ; Hatsui, Takaki ; Tsuru, T. ; Miura, Naruhisa ; Kasai, Hiroyuki ; Okihara, Masao
Author_Institution
Grad. Sch. of Pure & Appl. Sci., Univ. of Tsukuba, Tsukuba, Japan
fYear
2013
fDate
Oct. 27 2013-Nov. 2 2013
Firstpage
1
Lastpage
7
Abstract
We are developing monolithic pixel sensors based on a 0.2 μm fully-depleted silicon-on-Insulator (SOI) technology. The major issue in applications them in high-radiation environments is the total ionization damage (TID) effects. The effects are rather substantial in the SOI devices since the transistors are enclosed in the oxide layers where generated holes are trapped and affect the operation of the near-by transistors. The double SOI sensors that provide an independent electrode underneath the buried oxide layer have been developed. We have irradiated transistor test elements and pixel sensors with γ-rays. By adjusting the potential of this electrode, the TID effects are shown to be compensated. The pixel sensor irradiated to 20 kGy recovered its functionality by applying a bias to the electrode. The radiation tolerance of the SOI devices has been substantially improved by the double SOI.
Keywords
MOSFET; electric sensing devices; electrochemical electrodes; gamma-ray effects; hole traps; ionisation; silicon-on-insulator; γ-rays; SOI technology; Si; buried oxide layer; double SOI sensors; double silicon-on-insulator devices; fully-depleted silicon-on-insulator; generated holes trapping; high-radiation environments; independent electrode; irradiated transistor test elements; monolithic pixel sensors; near-by transistors; radiation tolerance; size 0.2 mum; total ionization damage effects; Electrodes; MOS devices; Radiation effects; Silicon; Threshold voltage; Tin; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2013 IEEE
Conference_Location
Seoul
Print_ISBN
978-1-4799-0533-1
Type
conf
DOI
10.1109/NSSMIC.2013.6829541
Filename
6829541
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