• DocumentCode
    687122
  • Title

    Simulation of the 3-D Coulomb explosion of the electron-hole distribution at high injection levels in 2-D semiconductor detectors

  • Author

    Castoldi, A. ; Zambon, P.

  • Author_Institution
    Dipt. di Elettron., Inf. e Bioingegneria, Inf. e Bioingegneria, Milan, Italy
  • fYear
    2013
  • fDate
    Oct. 27 2013-Nov. 2 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    We developed a novel simulation code for 3-D electron-hole transport and signal formation in semiconductor detectors. The code includes thermal diffusion and Coulomb interaction between the carriers - essential for the correct simulation of high-density ionization tracks. The present work focuses on dedicated numerical techniques to correctly simulate the explosion of high-density charge carrier clouds down to the first instants of the time evolution, when extremely high field intensities are reached due to Coulomb interaction between carriers. The case study of a p+nn+ diode irradiated by 1 keV photons on under different bias and charge injection conditions up to 107 e.h pairs is presented and discussed. This case well represents the operating conditions foreseen in the imaging detectors for the novel FEL X-ray facilities and the potential of the developed simulation code.
  • Keywords
    Coulomb blockade; semiconductor counters; semiconductor diodes; thermal diffusion; 2-D semiconductor detectors; 3-D Coulomb explosion; 3-D electron-hole transport; FEL X-ray facilities; bias conditions; charge injection conditions; electron volt energy 1 keV; electron-hole distribution; high injection levels; high-density ionization tracks; imaging detectors; p+nn+ diode; signal formation; simulation code; thermal diffusion; Charge carrier processes; Computational modeling; Detectors; Mathematical model; Mobile communication; Photonics; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2013 IEEE
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4799-0533-1
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2013.6829567
  • Filename
    6829567