• DocumentCode
    709020
  • Title

    On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer

  • Author

    Heegon Kim ; Sukjin Kim ; Joungho Kim ; Jingook Kim ; Changwook Yoon ; Achkir, Brice ; Jun Fan

  • Author_Institution
    TERA Lab., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2015
  • fDate
    15-21 March 2015
  • Firstpage
    22
  • Lastpage
    27
  • Abstract
    In this paper, the reduction of power distribution network noise and jitter at high-speed output buffer by using on-chip linear voltage regulator module circuit is introduced and analyzed. The transient response of typical on-chip linear VRM circuit is analyzed in power gating condition. When the on-chip linear VRM circuit is inserted between on-chip PDN and operating high-speed output buffers, the on-chip PDN noise and jitter at output buffer are significantly reduced. The larger on-chip decoupling capacitor leads to the lower PDN noise generated by on-chip linear VRM circuit. The on-chip linear VRM also reduces the impact of the aggressor buffer to the victim buffer in different PDN, resulting in the improved performance of the victim buffer. Reduction of PDN noise and jitter at output buffer using on-chip linear VRM are validated based on SPICE simulation with 110 nm CMOS technology library.
  • Keywords
    CMOS integrated circuits; buffer circuits; circuit noise; jitter; modules; power distribution; transient response; voltage regulators; CMOS technology library; PDN jitter; PDN noise; SPICE simulation; aggressor buffer; high-speed output buffer; on-chip decoupling capacitor; on-chip linear VRM circuit; power distribution network; power gating condition; size 110 nm; transient response; victim buffer; voltage regulator module circuit; Capacitors; Integrated circuit modeling; Jitter; Noise; Switches; System-on-chip; Transistors; PDN noise; jitter; on-chip linear voltage regulator module (VRM); power distribution network (PDN);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-1992-5
  • Type

    conf

  • DOI
    10.1109/EMCSI.2015.7107653
  • Filename
    7107653