• DocumentCode
    711041
  • Title

    Advanced atomic layer deposition and epitaxy processes (Invited paper)

  • Author

    Gordon, Roy G. ; Xiabing Lou ; Sang Bok Kim

  • Author_Institution
    Dept. of Chem. & Chem. Biol., Harvard Univ., Cambridge, MA, USA
  • fYear
    2015
  • fDate
    27-29 April 2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Atomic Layer Deposition (ALD) was used to grow single-crystalline epitaxial layers of high-k dielectric oxides on semiconductors with remarkably few defects or traps at the interfaces. La2O3 on GaAs(111) produced record-breaking transistors with both n-and p-channels, and CMOS circuits entirely in GaAs, including inverters, logic circuits and 5-stage ring oscillators. More conventionally oriented GaAs(100) substrates with etched (111) slopes also produced working transistors. ALD also grew single-crystalline epitaxial La2O3 films on Ge(111), and (Ca, Mg)O films on GaN(0001) substrates with high-quality epitaxial interfaces. These processes can be run in commercial ALD reactors using precursors produced by the Dow Chemical Company.
  • Keywords
    III-V semiconductors; atomic layer epitaxial growth; calcium compounds; elemental semiconductors; gallium arsenide; germanium; lanthanum compounds; magnesium compounds; wide band gap semiconductors; CaO-GaN; La2O3-Ga; La2O3-GaAs; La2O3-Ge; MgO-GaN; atomic layer deposition; epitaxial processes; high-k dielectric oxides; single crystalline epitaxial film growth; single crystalline epitaxial layers; Epitaxial growth; Gallium arsenide; Silicon; Surface treatment; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Application (VLSI-TSA), 2015 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2015.7117593
  • Filename
    7117593