• DocumentCode
    712842
  • Title

    A high current density SOI-LIGBT with Segmented Trenches in the Anode region for suppressing negative differential resistance regime

  • Author

    Long Zhang ; Jing Zhu ; Weifeng Sun ; Yicheng Du ; Hui Yu ; Keqin Huang ; Longxing Shi

  • Author_Institution
    Nat. ASIC Syst. Eng. Res. Center, Nanjing, China
  • fYear
    2015
  • fDate
    10-14 May 2015
  • Firstpage
    49
  • Lastpage
    52
  • Abstract
    A SOI-LIGBT with Segmented Trenches in the Anode region (STA-LIGBT) is proposed and compared with the separated shorted-anode LIGBT (SSA-LIGBT) for the first time. The proposed STA-LIGBT structure features that there are segmented trenches located between the P+ anode and the segmented N+ anodes. By employing the segmented trenches, the resistance between the P+ anode and the shorted N+ anode is significantly increased, which effectively suppresses the negative differential resistance (NDR). The experiments show that the STA-LIGBT with its blocking voltage of 540V can achieve a current density (JC) of 247 A/cm2 when the gate voltage is 10V and the anode voltage is 3V. With the same the NDR regime (the snapback voltage is 1.3V), the current density (JC) of the STA-LIGBT is about 170% of that of the SSA-LIGBT. The fabrication of the segmented trenches is compatible with the trench isolation process and no extra or complicated processes are needed.
  • Keywords
    anodes; insulated gate bipolar transistors; NDR regime; SOI-LIGBT; STA-LIGBT structure; anode region; blocking voltage; high current density SOI-LIGBT; negative differential resistance; negative differential resistance regime; segmented trenches; shorted-anode LIGBT; snapback voltage; trench isolation process; voltage 1.3 V; voltage 3 V; voltage 540 V; Anodes; Current density; Fabrication; Optical wavelength conversion; Resistance; Tin; Transmission line measurements; NDR regime; SOI-LIGBT; current density; segmented trenches; snapback voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
  • Conference_Location
    Hong Kong
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-6259-4
  • Type

    conf

  • DOI
    10.1109/ISPSD.2015.7123386
  • Filename
    7123386