DocumentCode
712842
Title
A high current density SOI-LIGBT with Segmented Trenches in the Anode region for suppressing negative differential resistance regime
Author
Long Zhang ; Jing Zhu ; Weifeng Sun ; Yicheng Du ; Hui Yu ; Keqin Huang ; Longxing Shi
Author_Institution
Nat. ASIC Syst. Eng. Res. Center, Nanjing, China
fYear
2015
fDate
10-14 May 2015
Firstpage
49
Lastpage
52
Abstract
A SOI-LIGBT with Segmented Trenches in the Anode region (STA-LIGBT) is proposed and compared with the separated shorted-anode LIGBT (SSA-LIGBT) for the first time. The proposed STA-LIGBT structure features that there are segmented trenches located between the P+ anode and the segmented N+ anodes. By employing the segmented trenches, the resistance between the P+ anode and the shorted N+ anode is significantly increased, which effectively suppresses the negative differential resistance (NDR). The experiments show that the STA-LIGBT with its blocking voltage of 540V can achieve a current density (JC) of 247 A/cm2 when the gate voltage is 10V and the anode voltage is 3V. With the same the NDR regime (the snapback voltage is 1.3V), the current density (JC) of the STA-LIGBT is about 170% of that of the SSA-LIGBT. The fabrication of the segmented trenches is compatible with the trench isolation process and no extra or complicated processes are needed.
Keywords
anodes; insulated gate bipolar transistors; NDR regime; SOI-LIGBT; STA-LIGBT structure; anode region; blocking voltage; high current density SOI-LIGBT; negative differential resistance; negative differential resistance regime; segmented trenches; shorted-anode LIGBT; snapback voltage; trench isolation process; voltage 1.3 V; voltage 3 V; voltage 540 V; Anodes; Current density; Fabrication; Optical wavelength conversion; Resistance; Tin; Transmission line measurements; NDR regime; SOI-LIGBT; current density; segmented trenches; snapback voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
Conference_Location
Hong Kong
ISSN
1943-653X
Print_ISBN
978-1-4799-6259-4
Type
conf
DOI
10.1109/ISPSD.2015.7123386
Filename
7123386
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