DocumentCode
718283
Title
New sectorized implantable microelectrode fabrication, packaging and ageing for neural sensing and stimulation
Author
Bottausci, F. ; Baleras, F. ; Pudda, C. ; Cochet, M. ; Chabrol, C. ; Sauter-Starace, F. ; Oziat, J. ; Rovetta, M. ; Icard, B. ; Guiraud, D. ; Divoux, J.L. ; Malbert, C.H. ; Henry, C. ; Maubert, S.
Author_Institution
DTBS, CEA Leti, Grenoble, France
fYear
2015
fDate
22-24 April 2015
Firstpage
466
Lastpage
469
Abstract
This paper describes the fabrication and the packaging of a flexible parylene-based multi-contact electrode embedded in a silicone-based cuff. This type of electrode is well suited for peripheral nerve recording and offers improved spatial selectivity. We conducted mechanical and electrical tests for assessing the reliability by using an accelerated lifetime protocol. Test structures made with platinum sandwiched with parylene C were designed. The accelerated lifetime soaking tests in phosphate buffered saline (PBS) solution at 67°C showed a longer life time (approximatively 4.5 years) with a dehydration bake introduction in the process flow and a parylene thickness increase. A specific test bench was developed for the mechanical cycling and for evaluating the mechanical robustness of the thin film devices.
Keywords
biochemistry; biomedical equipment; dissociation; microelectrodes; microfabrication; neurophysiology; platinum; polymers; thin film devices; Pt; accelerated lifetime soaking tests; dehydration bake; electrical tests; mechanical cycling; mechanical tests; neural sensing; neural stimulation; parylene C; parylene thickness; parylene-based multi-contact electrode; peripheral nerve recording; phosphate buffered saline solution; platinum sandwiched structures; sectorized implantable microelectrode fabrication; silicone-based cuff; temperature 67 degC; thin film devices; Aging; Contacts; Electrodes; Life estimation; Metals; Temperature measurement; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Neural Engineering (NER), 2015 7th International IEEE/EMBS Conference on
Conference_Location
Montpellier
Type
conf
DOI
10.1109/NER.2015.7146660
Filename
7146660
Link To Document