• DocumentCode
    718283
  • Title

    New sectorized implantable microelectrode fabrication, packaging and ageing for neural sensing and stimulation

  • Author

    Bottausci, F. ; Baleras, F. ; Pudda, C. ; Cochet, M. ; Chabrol, C. ; Sauter-Starace, F. ; Oziat, J. ; Rovetta, M. ; Icard, B. ; Guiraud, D. ; Divoux, J.L. ; Malbert, C.H. ; Henry, C. ; Maubert, S.

  • Author_Institution
    DTBS, CEA Leti, Grenoble, France
  • fYear
    2015
  • fDate
    22-24 April 2015
  • Firstpage
    466
  • Lastpage
    469
  • Abstract
    This paper describes the fabrication and the packaging of a flexible parylene-based multi-contact electrode embedded in a silicone-based cuff. This type of electrode is well suited for peripheral nerve recording and offers improved spatial selectivity. We conducted mechanical and electrical tests for assessing the reliability by using an accelerated lifetime protocol. Test structures made with platinum sandwiched with parylene C were designed. The accelerated lifetime soaking tests in phosphate buffered saline (PBS) solution at 67°C showed a longer life time (approximatively 4.5 years) with a dehydration bake introduction in the process flow and a parylene thickness increase. A specific test bench was developed for the mechanical cycling and for evaluating the mechanical robustness of the thin film devices.
  • Keywords
    biochemistry; biomedical equipment; dissociation; microelectrodes; microfabrication; neurophysiology; platinum; polymers; thin film devices; Pt; accelerated lifetime soaking tests; dehydration bake; electrical tests; mechanical cycling; mechanical tests; neural sensing; neural stimulation; parylene C; parylene thickness; parylene-based multi-contact electrode; peripheral nerve recording; phosphate buffered saline solution; platinum sandwiched structures; sectorized implantable microelectrode fabrication; silicone-based cuff; temperature 67 degC; thin film devices; Aging; Contacts; Electrodes; Life estimation; Metals; Temperature measurement; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Engineering (NER), 2015 7th International IEEE/EMBS Conference on
  • Conference_Location
    Montpellier
  • Type

    conf

  • DOI
    10.1109/NER.2015.7146660
  • Filename
    7146660