DocumentCode
720779
Title
The solution to enhance i-line stepper applications by improviing process overlay accuracy
Author
Sumiyoshi, Atsushi Shigenobu Yuhei ; Sasaki, Ryo ; Hasegawa, Yasuo ; Ushiku, Kentaro ; Sano, Hirotaka ; Takeshita, Bunsuke ; Miura, Seiya
Author_Institution
Canon Inc., Utsunomiya, Japan
fYear
2015
fDate
15-16 March 2015
Firstpage
1
Lastpage
3
Abstract
Canon has developed the world´s first stepper with the shot shape compensator called “SSC”, which independently controls x and y magnification of shots on a wafer. This SSC function enables steppers to achieve overlay accuracy equivalent to scanners. The most suitable application of this function is back side illumination (BSI) image sensors, which has large distortion on wafers because of bonding and thinning processes. In this paper, we will provide the detailed descriptions along with the exposure results using our new solutions.
Keywords
bonding processes; image sensors; semiconductor device manufacture; wafer bonding; back side illumination image sensors; i-line stepper applications; process overlay accuracy; shot shape compensator; Accuracy; Adaptive optics; Decision support systems; Distortion measurement; Optical distortion; Optical imaging; Optical sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location
Shanghai
ISSN
2158-2297
Type
conf
DOI
10.1109/CSTIC.2015.7153370
Filename
7153370
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