• DocumentCode
    720779
  • Title

    The solution to enhance i-line stepper applications by improviing process overlay accuracy

  • Author

    Sumiyoshi, Atsushi Shigenobu Yuhei ; Sasaki, Ryo ; Hasegawa, Yasuo ; Ushiku, Kentaro ; Sano, Hirotaka ; Takeshita, Bunsuke ; Miura, Seiya

  • Author_Institution
    Canon Inc., Utsunomiya, Japan
  • fYear
    2015
  • fDate
    15-16 March 2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Canon has developed the world´s first stepper with the shot shape compensator called “SSC”, which independently controls x and y magnification of shots on a wafer. This SSC function enables steppers to achieve overlay accuracy equivalent to scanners. The most suitable application of this function is back side illumination (BSI) image sensors, which has large distortion on wafers because of bonding and thinning processes. In this paper, we will provide the detailed descriptions along with the exposure results using our new solutions.
  • Keywords
    bonding processes; image sensors; semiconductor device manufacture; wafer bonding; back side illumination image sensors; i-line stepper applications; process overlay accuracy; shot shape compensator; Accuracy; Adaptive optics; Decision support systems; Distortion measurement; Optical distortion; Optical imaging; Optical sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Technology International Conference (CSTIC), 2015 China
  • Conference_Location
    Shanghai
  • ISSN
    2158-2297
  • Type

    conf

  • DOI
    10.1109/CSTIC.2015.7153370
  • Filename
    7153370