Novel approach to CMP slurry filtration through new generation nano-fiber technology

Reduced device feature size and new device manufacturing processes require more efficient management and control of the chemical mechanical planarization (CMP) process. One of the key parameters to lower defectivity is to control contaminants through the use of a CMP filter operation [1]. This paper discusses CMP slurry filtration methodologies and mechanisms along with the relationship between particle retention and particle size. The “shearing effects” of slurries are also studied with a consideration of contamination control and filter lifetime comparing nano-fiber technology and conventional technology. This information is an essential consideration to optimize CMP slurry filtration operations.