• DocumentCode
    720856
  • Title

    Reliability verification of multi-power domain designs using an integrated approach of symbolic and geometry analysis

  • Author

    Srinivasan, Sridhar ; Hung-Hsu Feng ; Yi-Ting Lee

  • Author_Institution
    Mentor Graphics Corp, Wilsonville, OR, USA
  • fYear
    2015
  • fDate
    15-16 March 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The paper describes verification techniques for certain layout design rules like deep n-well biasing, well implant and parasitic effects for mixed signal SOCs with multiple power domains. The technique analyzes the netlist and layout simultaneously and is superior to LVS methodology. Traditional LVS methodology is not effective because either some of these checks cannot be performed without putting in additional layout features or is not conducive to debugging. To explain our algorithm, we have shown examples of a Deep N-well biasing check and parasitic junction diode check because of multiple power domains. The verification technique and the algorithm presented in this paper were successfully used to verify 28nm and 20nm SOC designs with many power domains and internal derived supplies. All the errors reported were tagged with schematic and layout cross references along with the offending features, making it easier to identify and qualify the circuitry and signals for errors in question.
  • Keywords
    mixed analogue-digital integrated circuits; system-on-chip; LVS methodology; deep n-well biasing; geometry analysis; integrated approach; layout versus schematic methodology; mixed signal SOC; multipower domain design; parasitic effect; parasitic junction diode check; reliability verification technique; size 20 nm; size 28 nm; symbolic analysis; system-on-chip; well implant; Chirp; Erbium; Geometry; Junctions; Lead; Reliability engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Technology International Conference (CSTIC), 2015 China
  • Conference_Location
    Shanghai
  • ISSN
    2158-2297
  • Type

    conf

  • DOI
    10.1109/CSTIC.2015.7153480
  • Filename
    7153480