• DocumentCode
    721411
  • Title

    Simulation of expected areal density gain for heat assisted magnetic recording

  • Author

    Victora, R.H. ; Dong, Y. ; Huang, P. ; Wang, S. ; Wang, Y.

  • Author_Institution
    Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN, USA
  • fYear
    2015
  • fDate
    11-15 May 2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Areal density increases in conventional perpendicular magnetic recording are becoming increasingly difficult to achieve. Heat assisted magnetic recording is viewed as a potential technique to extend magnetic recording into the multiple-terabit range. Over the last 5 years, we have performed extensive simulations of Heat Assisted Magnetic Recording on both granular and bit-patterned media. For this purpose, we represent the behavior of granular media near the Curie temperature with renormalized blocks of spins of order 1 nm3. The change in magnetization of these blocks can then be evaluated using the Landau-Lifshitz-Gilbert equation. The behavior of bit patterned media is typically evaluated using an atomistic approach. Optical spots are calculated using a finite difference time domain technique and heat flow is evaluated using the usual Fourier differential equation. We have also evaluated the performance of competing technologies including both conventional and shingled recording of both granular and bit patterned media.
  • Keywords
    Curie temperature; differential equations; finite difference time-domain analysis; granular materials; heat transfer; thermomagnetic recording; Curie temperature; Fourier differential equation; Landau-Lifshitz-Gilbert equation; atomistic approach; bit patterned media; expected areal density gain; finite difference time domain technique; granular media; heat assisted magnetic recording; heat flow; magnetization; optical spots; Bit error rate; Heat-assisted magnetic recording; Heating; Insulation life; Media; Writing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference (INTERMAG), 2015 IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-7321-7
  • Type

    conf

  • DOI
    10.1109/INTMAG.2015.7156492
  • Filename
    7156492