• DocumentCode
    721757
  • Title

    Tuning of the microwave magnetization dynamics in Fe65Co35-based thin films by Dy Doping

  • Author

    Xu, Z. ; Yin, Y. ; Xu, F.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Nanjing Univ. of Sci. & Technol., Nanjing, China
  • fYear
    2015
  • fDate
    11-15 May 2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The tuning of the microwave characteristics of soft magnetic metallic thin films, especially the anisotropy field and the damping mechanism, is an important issue in their high-frequency dynamics of soft magnetic thin films. the ways to change the damping parameter are doping some non-magnetic compositions or diluting the ferromagnetic thin films with transition metal elements, material. Another choice is to take advantage of the exchange bias or exchange-coupling interactions between multilayers. Besides, Fe-Co alloys have been intensively investigated because of their very high saturation flux density. Sputter deposited Fe-Co films, however, generally show high coercivity and they are therefore not applicable as the write pole materials in a magnetic recording head. This work, we tuned the microwave magnetization dynamics Fe65Co35-based thin films by Dy Doping.
  • Keywords
    cobalt alloys; dysprosium; iron alloys; magnetic thin films; magnetisation; metallic thin films; soft magnetic materials; sputter deposition; Dy doping; Fe-Co alloys; Fe65Co35:Dy; anisotropy field; coercivity; damping mechanism; exchange bias; exchange-coupling interactions; ferromagnetic thin films; high-frequency dynamics; magnetic recording head; microwave magnetization dynamics; multilayers; nonmagnetic compositions; saturation flux density; soft magnetic metallic thin films; sputter deposited Fe-Co films; transition metal elements; write pole materials; Damping; Doping; Films; Magnetic properties; Magnetic resonance; Perpendicular magnetic anisotropy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference (INTERMAG), 2015 IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-7321-7
  • Type

    conf

  • DOI
    10.1109/INTMAG.2015.7156978
  • Filename
    7156978