Empirical investigations on die edge defects reductions in die singulation processes for glass-panel based interposers for advanced packaging

The authors evaluated various dicing methods in order to improve the TCT reliability against SeWaRe type of failures in glass interposers fabricated by polymer lamination over thin glass sheet cores. For blade-based dicing methods, the criteria for down-selection were (i) the least glass sidewall roughness and (ii) crack-free die edge visual inspections. In this fashion, a BKM dicing blade was identified that produced SeWaRe-free interposer dies upon dicing operations. Secondly, in order to compare the fracture strengths of glass produced by blade dicing with those of known methods, bare, thin glass sheet test specimens were made. In 2-point bending fracture strengths tests, glass strengths from three different blade dicing methods are similar to other score-and-break based separation methods. Lastly, a dicing process using a R&D laser system from DISCO Corp., which is not yet released-to-market, also successfully singulated the glass interposer samples. Samples produced by both blade and laser processes have been passing the TCT accelerated reliability tests.