• DocumentCode
    726413
  • Title

    A SPICE model of flexible transition metal dichalcogenide field-effect transistors

  • Author

    Ying-Yu Chen ; Zelei Sun ; Deming Chen

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2015
  • fDate
    8-12 June 2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper presents the first SPICE model of the transition metal dichalcogenide (TMD) field-effect transistor (FET), which is a promising candidate for flexible electronics. The model supports different transistor design parameters such as width, length, oxide thickness, and various channel materials (MoS2, WSe2, etc.), as well as the applied strain, which enables the evaluation of transistor- and circuit-level behavior under process variation and different levels of bending. We performed SPICE simulations on digital logic gates to explore the design space of both MoS2- and WSe2-based transistors, and to evaluate the projected performance of these circuits under applied strain. Our simulations show that WSe2 circuits outperform MoS2 and Si-based CMOS in terms of energy-delay product (EDP) by up to 1 order of magnitude, depending on applications. Finally, we investigate TMDFET´s behavior under process variation.
  • Keywords
    CMOS integrated circuits; field effect transistors; molybdenum compounds; semiconductor device models; silicon; tungsten compounds; CMOS process; MoS2; SPICE model; Si; TMD field-effect transistors; WSe2; circuit-level behavior; digital logic gates; energy-delay product; flexible electronics; flexible transition metal dichalcogenide; transistor-level behavior; Computational modeling; Delays; Field effect transistors; Integrated circuit modeling; Mathematical model; Photonic band gap; MoS2; SPICE; TMDFET; WSe2; compact modeling; exible electronics; process variation; simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (DAC), 2015 52nd ACM/EDAC/IEEE
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1145/2744769.2744782
  • Filename
    7167326