• DocumentCode
    726615
  • Title

    Switching noise suppression for hybrid IGBT modules

  • Author

    Nan Zhu ; Dehong Xu ; Xingyao Zhang ; Min Chen ; Igarashi, Seiki ; Fujihira, Tatsuhiko

  • Author_Institution
    Zhejiang Univ., Hangzhou, China
  • fYear
    2015
  • fDate
    1-5 June 2015
  • Firstpage
    829
  • Lastpage
    836
  • Abstract
    In a hybrid IGBT module with SiC diodes as free-wheeling diodes, high frequency oscillation occurs during turn-on, which will cause higher EMI noise due to the larger capacitance of SiC diode. To evaluate the influence of gate drive parameters on turn-on oscillation, different gate voltages and gate charge currents are used. It is found that by changing gate drive parameters alone cannot reduce the settling time of the oscillation significantly. Then an oscillation suppression method with damping circuits is proposed. According to the analytical and experimental results, the damping circuits are able to effectively accelerate the damping of turn-on oscillation without significant increase in current overshoot and turn-on energy loss. Finally to suppress the turn-on current overshoot, active gate driver method is also used without large increase in the turn-on energy loss. The combination of damping circuit and active gate driver may be an optimized choice to achieve the lowest EMI noise.
  • Keywords
    circuit oscillations; damping; driver circuits; electromagnetic interference; insulated gate bipolar transistors; interference suppression; silicon compounds; wide band gap semiconductors; EMI noise; SiC; SiC diodes; active gate driver method; damping circuits; free-wheeling diodes; gate charge currents; gate drive parameters; gate voltages; high frequency oscillation; hybrid IGBT module; oscillation suppression method; turn-on current overshoot; turn-on energy loss; turn-on oscillation; Capacitors; Damping; Energy loss; Insulated gate bipolar transistors; Logic gates; Oscillators; Resistors; Hybrid IGBT module; SiC SBD; active gate driver; turn-on oscillation damping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and ECCE Asia (ICPE-ECCE Asia), 2015 9th International Conference on
  • Conference_Location
    Seoul
  • Type

    conf

  • DOI
    10.1109/ICPE.2015.7167878
  • Filename
    7167878