• DocumentCode
    727409
  • Title

    Predicting Field Reliability

  • Author

    Rotella, Pete ; Chulani, Sunita ; Goyal, Devesh

  • Author_Institution
    Cisco Syst. Inc., Research Triangle Park, NC, USA
  • fYear
    2015
  • fDate
    19-19 May 2015
  • Firstpage
    12
  • Lastpage
    15
  • Abstract
    The objective of the work described is to accurately predict, as early as possible in the software lifecycle, how reliably a new software release will behave in the field. The initiative is based on a set of innovative mathematical models that have consistently shown a high correlation between key in-process metrics and our primary customer experience metric, SWDPMH (Software Defects per Million Hours [usage] per Month). We have focused on the three primary dimensions of testing -- incoming, fixed, and backlog bugs. All of the key predictive metrics described here are empirically-derived, and in specific quantitative terms have not previously been documented in the software engineering/quality literature. A key part of this work is the empirical determination of the precision of the measurements of the primary predictive variables, and the determination of the prediction (outcome) error. These error values enable teams to accurately gauge bug finding and fixing progress, week by week, during the primary test period.
  • Keywords
    program testing; software metrics; software quality; software reliability; SWDPMH; backlog bugs; field reliability prediction; innovative mathematical models; key in-process metrics; key predictive metrics; prediction error determination; primary customer experience metric; primary predictive variables; software defects per million hours per month; software engineering; software quality; Correlation; Mathematical model; Measurement errors; Predictive models; Software; Testing; customer experience; error analysis; modeling; prediction; software release reliability; testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Release Engineering (RELENG), 2015 IEEE/ACM 3rd International Workshop on
  • Conference_Location
    Florence
  • Type

    conf

  • DOI
    10.1109/RELENG.2015.13
  • Filename
    7169445