• DocumentCode
    729072
  • Title

    Near-field injection at die level

  • Author

    Boyer, A. ; Vrignon, B. ; Shepherd, J.

  • Author_Institution
    LAAS, Toulouse, France
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    478
  • Lastpage
    481
  • Abstract
    Near-field injection is a promising method in order to induce local faults in integrated circuits. This paper aims at proposing a model of the coupling between the injection probe and the circuit under test. This study relies on measurements performed on a test chip by on-chip voltage sensors.
  • Keywords
    integrated circuit modelling; integrated circuit testing; circuit under test; die level; injection probe; integrated circuits; local faults; near-field injection; on-chip voltage sensors; test chip; Couplings; Integrated circuit modeling; Magnetic fields; Probes; Voltage measurement; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4799-6668-4
  • Type

    conf

  • DOI
    10.1109/APEMC.2015.7175281
  • Filename
    7175281
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=729072