• DocumentCode
    729164
  • Title

    Efficient method for predictive package Power/Ground planes modeling using Multi-Conductor Transmission Lines

  • Author

    Bouchaala, Afef ; Courau, Lionel ; Galy, Philippe ; Bonnaud, Olivier

  • Author_Institution
    STMicroelectron., Crolles, France
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    113
  • Lastpage
    116
  • Abstract
    Due to the high speed and system miniaturization trends in circuit design, predictive modeling of Power Distribution Network (PDN) in modern multilayered packages and boards becomes more and more important. To reduce design iterations due to signal and power integrity issues, the PDN model needs to be anticipated at early design stage, even if layout is not yet designed. Typical package PDNs consists of multiple layers of Power/Ground planes hence we can model it with a mesh of Multi-Conductor Transmission Lines (MCTLs). This paper presents a fast and efficient method based on unit MCTL calibration for a predictive modeling of different PDNs sizes.
  • Keywords
    integrated circuit interconnections; integrated circuit packaging; multiconductor transmission lines; MCTL; PDN model; circuit design; ground planes modeling; multiconductor transmission lines; multilayered packages; power distribution network; power planes modeling; predictive modeling; system miniaturization trends; Analytical models; Method of moments; Predictive models;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4799-6668-4
  • Type

    conf

  • DOI
    10.1109/APEMC.2015.7175393
  • Filename
    7175393