DocumentCode
729164
Title
Efficient method for predictive package Power/Ground planes modeling using Multi-Conductor Transmission Lines
Author
Bouchaala, Afef ; Courau, Lionel ; Galy, Philippe ; Bonnaud, Olivier
Author_Institution
STMicroelectron., Crolles, France
fYear
2015
fDate
26-29 May 2015
Firstpage
113
Lastpage
116
Abstract
Due to the high speed and system miniaturization trends in circuit design, predictive modeling of Power Distribution Network (PDN) in modern multilayered packages and boards becomes more and more important. To reduce design iterations due to signal and power integrity issues, the PDN model needs to be anticipated at early design stage, even if layout is not yet designed. Typical package PDNs consists of multiple layers of Power/Ground planes hence we can model it with a mesh of Multi-Conductor Transmission Lines (MCTLs). This paper presents a fast and efficient method based on unit MCTL calibration for a predictive modeling of different PDNs sizes.
Keywords
integrated circuit interconnections; integrated circuit packaging; multiconductor transmission lines; MCTL; PDN model; circuit design; ground planes modeling; multiconductor transmission lines; multilayered packages; power distribution network; power planes modeling; predictive modeling; system miniaturization trends; Analytical models; Method of moments; Predictive models;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
Conference_Location
Taipei
Print_ISBN
978-1-4799-6668-4
Type
conf
DOI
10.1109/APEMC.2015.7175393
Filename
7175393
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