• DocumentCode
    729297
  • Title

    10 nm nominal channel length MoS2 FETs with EOT 2.5 nm and 0.52 mA/µm drain current

  • Author

    Yang, L. ; Lee, R.T.P. ; Papa Rao, S.S. ; Tsai, W. ; Ye, P.D.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2015
  • fDate
    21-24 June 2015
  • Firstpage
    237
  • Lastpage
    238
  • Abstract
    Summary form only given. In this abstract, multi-layer MoS2 field-effect transistors (FET) [1] with record short 10 nm nominal channel length (Lch) and ultrathin gate dielectric (EOT~2.5 nm) have been demonstrated. These aggressively scaled devices show high performances including a drain current of 0.52 mA/μm, an on/off ratio larger than 106 and an extrinsic transconductance of 142 μS/μm. This study sheds light on the impact of channel thickness, channel length and gate dielectric scaling in multi-layer MoS2 FETs.
  • Keywords
    dielectric materials; field effect transistors; molybdenum compounds; EOT; FET; MoS2; channel thickness; drain current; extrinsic transconductance; multilayer field-effect transistors; nominal channel length; size 10 nm; ultrathin gate dielectric; Fabrication; Field effect transistors; Hafnium compounds; Logic gates; Nickel; Resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference (DRC), 2015 73rd Annual
  • Conference_Location
    Columbus, OH
  • Print_ISBN
    978-1-4673-8134-5
  • Type

    conf

  • DOI
    10.1109/DRC.2015.7175655
  • Filename
    7175655