• DocumentCode
    732055
  • Title

    Versatile CMOS-MEMS integrated piezoelectric platform

  • Author

    Tsai, J.M. ; Daneman, M. ; Boser, B. ; Horsley, D. ; Rais-Zadeh, M. ; Tang, H.Y. ; Lu, Y. ; Rozen, O. ; Liu, F. ; Lim, M. ; Assaderaghi, F.

  • Author_Institution
    InvenSense Inc., San Jose, CA, USA
  • fYear
    2015
  • fDate
    21-25 June 2015
  • Firstpage
    2248
  • Lastpage
    2251
  • Abstract
    We present the extension of the InvenSense fabrication platform to piezoelectric transduction. The newly proposed CMOS-MEMS Integrated Piezoelectric Platform inherits the wafer bonding advantages of its predecessor, leverages existing semiconductor infrastructure, and is applicable to a wide range of applications.
  • Keywords
    CMOS integrated circuits; micromechanical devices; piezoelectric transducers; wafer bonding; CMOS-MEMS integrated piezoelectric platform; InvenSense fabrication platform; piezoelectric transduction; semiconductor infrastructure; wafer bonding; Aluminum nitride; CMOS integrated circuits; Cavity resonators; III-V semiconductor materials; Micromechanical devices; Substrates; Varactors; CMOS integration; Fabrication platform; MEMS; piezoelectric;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
  • Conference_Location
    Anchorage, AK
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2015.7181409
  • Filename
    7181409
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=732055