DocumentCode
733582
Title
Heterogeneous 2D and 3D photonic integration for future chip-scale microsystems
Author
Yoo, S. J. Ben
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of California, Davis, Davis, CA, USA
fYear
2015
fDate
10-15 May 2015
Firstpage
1
Lastpage
2
Abstract
This tutorial reviews state-of-the-art heterogeneous 2D/3D photonic integration technologies involving various novel fabrication techniques leading to realization of chip-scale microsystems with photonic-electronic-integrated-circuits. Future prospects and challenges in computing and networking applications will also be discussed.
Keywords
integrated optoelectronics; optical computing; reviews; three-dimensional integrated circuits; chip-scale microsystems; computing applications; fabrication techniques; heterogeneous 2D photonic integration; heterogeneous 3D photonic integration; networking applications; photonic-electronic-integrated-circuits; reviews; Indium phosphide; Optical waveguides; Photonics; Silicon; Silicon compounds; Three-dimensional displays; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics (CLEO), 2015 Conference on
Conference_Location
San Jose, CA
Type
conf
Filename
7184023
Link To Document