• DocumentCode
    739565
  • Title

    Analysis of Active-Clamp Response to Power-On ESD: Power Supply Integrity and Performance Tradeoffs

  • Author

    Mertens, Robert ; Thomson, Nicholas ; Yang Xiu ; Rosenbaum, Elyse

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • Volume
    15
  • Issue
    3
  • fYear
    2015
  • Firstpage
    263
  • Lastpage
    271
  • Abstract
    An active rail clamp circuit provides protection against component-level ESD; this work explores the challenges associated with designing a rail clamp to additionally provide protection when the IC is powered on. The fast transient response required to protect against ESD makes it difficult to design a stable circuit and introduces tradeoffs between supply integrity and the clamping characteristic. This work presents an analysis of how these performance metrics are affected by device sizes. Interactions between a rail clamp circuit, which may be an active or passive clamp, and the parasitic elements of the package and board are examined; it is shown that these interactions may briefly power down the supply.
  • Keywords
    clamps; electrostatic discharge; integrated circuit design; integrated circuit packaging; integrated logic circuits; logic design; transient response; trigger circuits; IC; active clamp; active rail clamp circuit; active-clamp response; clamping characteristic; component-level ESD; electrostatic discharge; integrated circuits; parasitic elements; passive clamp; power supply integrity; power-on ESD; transient response; Circuit stability; Clamps; Electrostatic discharges; Impedance; Rails; Stability analysis; Trigger circuits; Circuit Stability; Circuit stability; Electromagnetic Compatibility; Electrostatic Discharge; Immunity Testing; Integrated Circuit Reliability; System-Level ESD; electromagnetic compatibility; electrostatic discharge; immunity testing; integrated circuit reliability; system-level ESD;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2015.2464222
  • Filename
    7177068