Loss Performance of Planar Interconnects on FR-4 Up to 67 GHz

Author

Aroor, Supreetha Rao ; Henderson, Rashaunda M.

Author_Institution

Univ. of Texas at Dallas, Richardson, TX, USA

Volume

3

Issue

12

fYear

2013

fDate

Dec. 2013

Firstpage

2127

Lastpage

2133

Abstract

This paper shows the performance of planar transmission lines (TLs) on a multilayer stack-up with a flame resistant-4 (FR-4)-based core up to 67 GHz. These lines will be used as interconnects to integrate a CMOS circuit with an antenna fabricated on FR-4 for a low-cost system-in-package solution. The attenuation characteristics of coplanar waveguide (CPW), grounded coplanar waveguide (GCPW), and microstrip lines with different configurations are investigated. The peak attenuation varies from 0.15 to 0.45 dB/mm at 60 GHz, depending on the line type and geometry. In addition, the effective permittivity and loss tangent of the multilayer stack-up are determined using CPW TLs. The overall results show that FR-4-based materials are viable candidates for packaging at the millimeter-wave frequency range if suitable line lengths are utilized.

Keywords

CMOS integrated circuits; coplanar waveguides; integrated circuit interconnections; microstrip lines; CMOS circuit; CPW TLs; FR-4-based materials; GCPW; attenuation characteristics; flame resistant-4; frequency 60 GHz; grounded coplanar waveguide; loss performance; microstrip lines; millimeter-wave frequency range; multilayer stack-up; planar interconnects; planar transmission lines; system-in-package solution; Attenuation; Coplanar waveguides; Integrated circuit interconnections; Microstrip; Millimeter wave technology; Permittivity; Transmission lines; Attenuation; interconnects; millimeter-wave; transmission lines (TLs);

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2013.2264475

Filename

6545341