• DocumentCode
    745868
  • Title

    Modeling of particle arrangement in an isotropically conductive adhesive joint

  • Author

    Mündlein, Martin ; Nicolics, Johann

  • Author_Institution
    Inst. of Sensor & Actuator Syst., Vienna Univ. of Technol., Austria
  • Volume
    28
  • Issue
    4
  • fYear
    2005
  • Firstpage
    765
  • Lastpage
    770
  • Abstract
    An isotropically conductive adhesive (ICA) is a composite material consisting of a nonconductive polymer binder and conductive filler particles. When the filler content is high enough the nonconductive binder is transformed into a good electrical conductor. This transition can be described by the percolation theory. We present a two-dimensional model to analyze the principal influences of the geometrical and electrical properties of the filler particles on the percolation threshold and the electrical resistance of an ICA joint. With this model, the arrangement of the particles within the joint is calculated by considering different types of forces. Taking into account the electrical properties of the particles, the electrical contact behavior is investigated. The goal of this study is to provide a deeper understanding of the changes of the macroscopic contact behavior due to different environmental impacts.
  • Keywords
    adhesives; composite materials; contact resistance; electric properties; electrical contacts; filler metals; percolation; 2D model; composite material; conductive filler particles; contact resistance; electrical conductor; electrical contact behavior; electrical resistance; environmental impact; filler content; isotropically conductive adhesive joint; macroscopic contact behavior; nonconductive binder; nonconductive polymer binder; particle arrangement; percolation theory; Composite materials; Conducting materials; Conductive adhesives; Contact resistance; Electric resistance; Independent component analysis; Polymers; Probability; Solid modeling; Temperature; Contact resistance; isotropically conductive adhesive (ICA); particle arrangement; simulation;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.859671
  • Filename
    1546188