DocumentCode
746939
Title
PCB integrated inductors for low power DC/DC converter
Author
Ludwig, Matthias ; Duffy, Maeve ; O´Donnell, Terence ; McCloskey, Paul ; Mathuna, Seán Cian Ó
Author_Institution
Energy Process. for ICT, Nat. Microelectron. Res. Centre, Cork, Ireland
Volume
18
Issue
4
fYear
2003
fDate
7/1/2003 12:00:00 AM
Firstpage
937
Lastpage
945
Abstract
This paper discusses the use of printed circuit board (PCB) integrated inductors for low power DC/DC buck converters. Coreless, magnetic plates and closed core structures are compared in terms of achievable inductance, power handling and efficiency in a footprint of 10 × 10 mm2. The magnetic layers consist of electroplated NiFe, so that the process is fully compatible with standard PCB process. Analytic and finite element method (FEM) methods are applied to predict inductor performance for typical current waveforms encountered in a buck converter. Conventional magnetic design procedures are applied to define optimum winding and core structures for typical inductor specifications. A 4.7 μH PCB integrated inductor with dc current handling of up to 500 mA is presented. This inductor is employed in a 1.5 W buck converter using a commercial control integrated circuit (IC). The footprint of the entire converter measures 10 × 10 mm2 and is built on top of the integrated inductor to demonstrate the concept of integrated passives in power electronic circuits to achieve ultra flat and compact converter solutions.
Keywords
DC-DC power convertors; finite element analysis; power inductors; power integrated circuits; printed circuits; windings; 1.5 W; 10 mm; 500 mA; NiFe; PCB integrated inductors; closed core structures; control integrated circuit; coreless magnetic plates; electroplated NiFe; finite element method; low power DC/DC power converter; magnetic design procedures; magnetic layers; optimum core structures; optimum winding structures; Buck converters; DC-DC power converters; Finite element methods; Inductance; Inductors; Magnetic analysis; Magnetic cores; Performance analysis; Power measurement; Printed circuits;
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2003.813757
Filename
1214515
Link To Document