Contact Resistance Estimation for Time-Dependent Silicone Elastomer Matrix of Land Grid Array Socket

Author

Yang, Shuang ; Wu, Ji ; Tsai, Derek ; Pecht, Michael G.

Author_Institution

CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD

Volume

30

Issue

1

fYear

2007

fDate

3/1/2007 12:00:00 AM

Firstpage

81

Lastpage

85

Abstract

A land grid array (LGA) socket provides high-density, electrically-separable interconnect between a component and a printed circuit board. The LGA socket must not be susceptible to creep and stress relaxation, which can lead to loss of contact force and consequently the degradation of contact resistance. In this paper, the time-dependent contact resistance failure mechanisms were experimentally assessed and theoretically analyzed for silicone elastomer matrix socket interconnects. A time-dependent physics-of-failure model was developed for contact resistance simulation

Keywords

ball grid arrays; contact resistance; elastomers; electric connectors; interconnections; LGA socket; contact resistance estimation; contact resistance failure mechanisms; land grid array socket; physics-of-failure model; printed circuit board; silicone elastomer matrix socket interconnects; time-dependent silicone elastomer matrix; Contact resistance; Creep; Degradation; Failure analysis; Integrated circuit interconnections; LAN interconnection; Printed circuits; Sockets; Stress; Transmission line matrix methods; Contact force; contact resistance; creep; land grid array (LGA); socket; stress relaxation;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2007.892075

Filename

4135414