Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis

Author

Jang, Changsoo ; Goswami, Arindam ; Han, Bongtae

Author_Institution

Dept. of Mech. Eng., Univ. of Maryland, College Park, MD

Volume

18

Issue

3

fYear

2009

fDate

6/1/2009 12:00:00 AM

Firstpage

577

Lastpage

587

Abstract

A gas transport mechanism is studied to characterize the hermetic behavior of polymer-sealed microelectromechanical systems packages. Diffusion-based governing equations, which are fundamentally different from the conduction-based governing equations used for metallic seals, are proposed to predict a change in cavity pressure. An effective numerical scheme is developed to implement the governing equations. The validity of the governing equations is corroborated by the optical leak test. The verified gas diffusion model is utilized to investigate the effect of the diffusion properties and geometries of polymeric seals on the gas leak behavior.

Keywords

diffusion; electronics packaging; hermetic seals; leak detection; micromechanical devices; polymers; MEMS packages; cavity pressure; diffusion-based governing equations; gas diffusion analysis; gas leak behavior; hermeticity; metallic seals; microelectromechanical systems packages; optical leak test; polymeric seals; Gas diffusion; gas leakage; hermeticity; microelectromechanical systems (MEMS) package; polymer seals;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/JMEMS.2009.2016283

Filename

4838947