• DocumentCode
    751392
  • Title

    Fully compliant tensural bistable micromechanisms (FTBM)

  • Author

    Wilcox, Daniel L. ; Howell, Larry L.

  • Author_Institution
    Dept. of Mech. Eng., Brigham Young Univ., Provo, UT, USA
  • Volume
    14
  • Issue
    6
  • fYear
    2005
  • Firstpage
    1223
  • Lastpage
    1235
  • Abstract
    A new class of bistable mechanisms, the fully compliant tensural bistable micromechanism (FTBM) class, is introduced. The class consists of linear bistable micromechanisms that undergo tension loads, in addition to the bending loads present, through their range of motion. Proof-of-concept designs fabricated in two different microelectromechanical systems (MEMS) surface micromachining processes were demonstrated. Three sets of refined designs within the FTBM class were designed using optimization methods linked with nonlinear finite element analysis (FEA), then fabricated and tested. Measured force and displacement performance are compared to values obtained by FEA. On-chip actuation of the bistable mechanisms was achieved using thermomechanical in-plane microactuators (TIMs). The FTBM class of bistable mechanisms explores a relatively new design space for fully compliant micromechanisms, and mechanisms from this class have promise in such applications as micro shutter positioning, microvalves, and electrical microrelays. [1448].
  • Keywords
    finite element analysis; microactuators; micromachining; microrelays; microvalves; optimisation; FTBM; bending loads; displacement performance; force performance; fully compliant micromechanisms; fully compliant tensural bistable micromechanisms; linear bistable micromechanisms; micro shutter positioning; microelectromechanical systems; microrelays; microvalves; nonlinear finite element analysis; on-chip actuation; optimization methods; proof-of-concept designs; refined designs; surface micromachining; tension loads; thermomechanical in-plane microactuators; Design methodology; Displacement measurement; Finite element methods; Force measurement; Microelectromechanical systems; Micromachining; Micromechanical devices; Optimization methods; Testing; Thermomechanical processes; Bistable mechanisms; compliant mechanisms; on-chip actuation;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2005.859089
  • Filename
    1549857