DocumentCode
751392
Title
Fully compliant tensural bistable micromechanisms (FTBM)
Author
Wilcox, Daniel L. ; Howell, Larry L.
Author_Institution
Dept. of Mech. Eng., Brigham Young Univ., Provo, UT, USA
Volume
14
Issue
6
fYear
2005
Firstpage
1223
Lastpage
1235
Abstract
A new class of bistable mechanisms, the fully compliant tensural bistable micromechanism (FTBM) class, is introduced. The class consists of linear bistable micromechanisms that undergo tension loads, in addition to the bending loads present, through their range of motion. Proof-of-concept designs fabricated in two different microelectromechanical systems (MEMS) surface micromachining processes were demonstrated. Three sets of refined designs within the FTBM class were designed using optimization methods linked with nonlinear finite element analysis (FEA), then fabricated and tested. Measured force and displacement performance are compared to values obtained by FEA. On-chip actuation of the bistable mechanisms was achieved using thermomechanical in-plane microactuators (TIMs). The FTBM class of bistable mechanisms explores a relatively new design space for fully compliant micromechanisms, and mechanisms from this class have promise in such applications as micro shutter positioning, microvalves, and electrical microrelays. [1448].
Keywords
finite element analysis; microactuators; micromachining; microrelays; microvalves; optimisation; FTBM; bending loads; displacement performance; force performance; fully compliant micromechanisms; fully compliant tensural bistable micromechanisms; linear bistable micromechanisms; micro shutter positioning; microelectromechanical systems; microrelays; microvalves; nonlinear finite element analysis; on-chip actuation; optimization methods; proof-of-concept designs; refined designs; surface micromachining; tension loads; thermomechanical in-plane microactuators; Design methodology; Displacement measurement; Finite element methods; Force measurement; Microelectromechanical systems; Micromachining; Micromechanical devices; Optimization methods; Testing; Thermomechanical processes; Bistable mechanisms; compliant mechanisms; on-chip actuation;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2005.859089
Filename
1549857
Link To Document