3-D Numerical Modeling and Circuit Extraction Techniques for the Analysis of Unshielded Twisted Pairs

Author

Caniggia, S. ; Maffucci, A. ; Maradei, F. ; Villone, F. ; Zamboni, W.

Author_Institution

EMC Consultant, Bareggio, MI

Volume

43

Issue

4

fYear

2007

fDate

4/1/2007 12:00:00 AM

Firstpage

1357

Lastpage

1360

Abstract

A three-dimensional full-wave surface integral formulation is used to predict the terminal response of unshielded twisted pairs. The proposed approach allows taking into account the skin effect, proximity effect and radiation losses. The proposed full-wave simulation is validated by comparing the results with those obtained by a software tool based on the finite integration technique, discussing advantages and limitations. The surface integral formulation results obtained on a short length of the line are used to predict the behavior of a longer line. In addition, they are used to extract equivalent circuits suitable for the time domain analysis by any commercial circuit simulator

Keywords

circuit simulation; equivalent circuits; integration; skin effect; time-domain analysis; 3D numerical modeling; circuit extraction techniques; equivalent circuit extraction; finite integration technique; proximity effect; radiation loss; skin effect; software tool; terminal response; three-dimensional full-wave surface integral formulation; time domain analysis; unshielded twisted pair analysis; Analytical models; Circuit simulation; Computational modeling; Conductors; Equivalent circuits; Integral equations; Numerical models; Proximity effect; Skin effect; Time domain analysis; Integral equations; nonuniform transmission lines; numerical analysis; unshielded twisted pairs (UTPs);

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/TMAG.2007.892424

Filename

4137681