DocumentCode
766714
Title
Bonding wires to quantized Hall resistors
Author
Lee, Kevin C.
Author_Institution
Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Volume
44
Issue
2
fYear
1995
fDate
4/1/1995 12:00:00 AM
Firstpage
249
Lastpage
253
Abstract
Three different techniques for attaching wires to quantized Hall resistors with gold-germanium-nickel (AuGe/Ni) alloyed contacts were evaluated. The best quality and most robust samples were made by evaporating bonding pads that overlapped the alloyed contacts and the substrate, so that bonds could be made over the substrate rather than over the heterostructure
Keywords
electric resistance measurement; electrical contacts; germanium alloys; gold alloys; measurement standards; nickel alloys; quantum Hall effect; resistors; soldering; AuGe-Ni; AuGe/Ni alloyed contacts; GaAs-AlGaAs; alloyed contacts; bonding pads; bonding wires; evaporation; heterostructure; quantized Hall resistors; resistance standards; soldering; Bonding; Contacts; Cryogenics; Gallium arsenide; Gold alloys; Joining processes; Nickel alloys; Resistors; Temperature; Wires;
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/19.377823
Filename
377823
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