DocumentCode
77273
Title
CMOS-Compatible Integrated Spectrometer Based on Echelle Diffraction Grating and MSM Photodetector Array
Author
Xiao Ma ; Mingyu Li ; Jian-Jun He
Author_Institution
State Key Lab. of Modern Opt. Instrum., Zhejiang Univ., Hangzhou, China
Volume
5
Issue
2
fYear
2013
fDate
Apr-13
Firstpage
6600807
Lastpage
6600807
Abstract
We demonstrate an integrated spectrometer-on-a-chip composed of an echelle diffraction grating (EDG) and metal-semiconductor-metal (MSM) waveguide photodetector array based on silicon-on-insulator (SOI). In the passive section, silicon oxynitride (SiON) is chosen as the material for the waveguide core and is deposited after selectively removing the top silicon layer of the SOI wafer. The buried silicon dioxide layer of the SOI wafer functions as the lower cladding for the SiON core waveguide. In the active section, the MSM photodetector array is fabricated on the top silicon layer of the SOI waveguide with a pitch width of 7.5 μm. With the butt-coupling structure, a responsivity of 0.41 A/W is obtained at 850 nm. Based on the CMOS-compatible fabrication process, we have fabricated a 60-channel spectrometer with a chip size of 9 mm × 6 mm operating around 850 nm. The measured channel spacing is 0.494 nm, with an adjacent channel crosstalk around 18 dB. The channel nonuniformity is less than 1.5 dB. The CMOS-compatible spectrometer with integrated silicon photodetector array can provide a low-cost solution for high-resolution on-chip spectral analysis for visible and near-infrared light with the wavelength below 1100 nm.
Keywords
CMOS integrated circuits; adjacent channel interference; channel spacing; diffraction gratings; metal-semiconductor-metal structures; optical arrays; optical crosstalk; optical fabrication; optical planar waveguides; photodetectors; silicon compounds; silicon-on-insulator; slabs; spectral analysis; spectrometers; CMOS-compatible integrated spectrometer; EDG; MSM photodetector array; SOI; Si; adjacent channel crosstalk; buried silicon dioxide layer; butt-coupling structure; channel spacing; echelle diffraction grating; integrated silicon photodetector array; integrated spectrometer-on-a-chip; metal-semiconductor-metal; pitch width; responsivity; silicon oxynitride; silicon-on-insulator; size 6 mm; size 9 mm; spectral analysis; wafer functions; waveguide photodetector array; wavelength 850 nm; Arrayed waveguide gratings; Arrays; Diffraction gratings; Gratings; Photodetectors; Silicon; Spectrometer-on-a-chip; echelle diffraction grating (EDG); metal–semiconductor–metal (MSM) photodetector array; optoelectronic integration;
fLanguage
English
Journal_Title
Photonics Journal, IEEE
Publisher
ieee
ISSN
1943-0655
Type
jour
DOI
10.1109/JPHOT.2013.2250944
Filename
6472720
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