Semiconductor yield improvement: results and best practices

Author

Cunningham, Sean P. ; Spanos, Costas J. ; Voros, Katalin

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA

Volume

8

Issue

2

fYear

1995

fDate

5/1/1995 12:00:00 AM

Firstpage

103

Lastpage

109

Abstract

The results of a world-wide study on yield improvement are presented. Die yields collected from 21 fabs are transformed via a logit formula and compared. The die yields and die yield improvement rates of the fabs are compared, and manufacturing yield improvement practices are evaluated. Preliminary results of this continuing study indicate that die yield improvement is a function of computer-aided manufacturing practices and statistical process control practices in addition to commonly cited practices such as particle control and advanced manufacturing technology

Keywords

integrated circuit yield; process control; semiconductor device manufacture; statistical process control; computer-aided manufacturing; die yields; fabs; logit formula; manufacturing technology; particle control; semiconductor yield; statistical process control; Assembly; Best practices; Computer aided manufacturing; Fabrication; Failure analysis; Manufacturing industries; Manufacturing processes; Production facilities; Semiconductor device manufacture; Testing;

fLanguage

English

Journal_Title

Semiconductor Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

0894-6507

Type

jour

DOI

10.1109/66.382273

Filename

382273