• DocumentCode
    77603
  • Title

    Study of High-k/Metal-Gate Work-Function Variation Using Rayleigh Distribution

  • Author

    Hyohyun Nam ; Changhwan Shin

  • Author_Institution
    Univ. of Seoul, Seoul, South Korea
  • Volume
    34
  • Issue
    4
  • fYear
    2013
  • fDate
    Apr-13
  • Firstpage
    532
  • Lastpage
    534
  • Abstract
    By using a Monte Carlo simulation for the stochastic distribution of grain sizes, the work-function variation (WFV) in high-k/metal-gate (HK/MG) is quantitatively and simply estimated with improved physical validity, with a Rayleigh distribution. Based on the Rayleigh distribution for the grain sizes, the WFV calculation for a TiN gate-stack is validated by previous experimental and simulation results. Additionally, a parameter for the WFV, i.e., ratio of the average grain size to the gate area (RGG), is suggested in this paper. This paves a new path to answer the following questions: 1) to what extent can the grain size of metal-gate materials be minimized to satisfy statistical targets? 2) to what extent can the physical gate area of metal oxide semiconductor field-effect transistors be scaled down whether the total variation is mainly limited by the WFV? Finally, it is concluded that a new HK/MG gate-stack should be developed to have the slope of <; 122 mV in the σ (WFV) versus RGG plot.
  • Keywords
    MOSFET; Monte Carlo methods; grain size; statistical distributions; stochastic processes; work function; HK-MG gate-stack; Monte Carlo simulation; RGG plot; Rayleigh distribution; WFV calculation; gate area; grain size stochastic distribution; high-k-metal-gate work-function variation; metal oxide semiconductor field-effect transistors; metal-gate materials; physical validity; statistical target; Grain size; High K dielectric materials; Logic gates; Transistors; Characterization; metal oxide semiconductor field-effect transistor; variability; work-function variation;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2247376
  • Filename
    6472749