DocumentCode
777193
Title
Real-time optical thermometry during semiconductor processing
Author
Herman, Irving P.
Author_Institution
Dept. of Appl. Phys., Columbia Univ., New York, NY, USA
Volume
1
Issue
4
fYear
1995
fDate
12/1/1995 12:00:00 AM
Firstpage
1047
Lastpage
1053
Abstract
The optical techniques used to monitor the temperature of wafers during semiconductor processing are surveyed. The physical principles underlying each method are described. Applications of each optical diagnostic are presented, along with the strengths and weaknesses of the probe. Most of these optical diagnostics have been implemented in research reactors to monitor wafer temperature during one or several types of thin-film processing, such as molecular beam epitaxy, rapid thermal processing, and plasma etching. Pyrometry is the workhorse of noninvasive optical probes of temperature, although it needs supporting models and optical measurements to improve accuracy. Other optical thermometric wafer diagnostics are very promising and are being developed intensively, particularly reflection interferometry, transmission spectroscopy, and various interferometry methods that directly measure the thermal expansion of the wafer
Keywords
light interferometry; molecular beam epitaxial growth; pyrometers; rapid thermal processing; reflectometry; semiconductor technology; spectral methods of temperature measurement; sputter etching; thermal expansion measurement; visible spectroscopy; interferometry methods; molecular beam epitaxy; noninvasive optical probes; plasma etching; pyrometry; rapid thermal processing; real-time optical thermometry; reflection interferometry; semiconductor processing; thermal expansion measurement; thin-film processing; transmission spectroscopy; wafer temperature monitoring; Inductors; Molecular beam epitaxial growth; Optical films; Optical interferometry; Plasma measurements; Plasma temperature; Probes; Semiconductor thin films; Temperature measurement; Temperature sensors;
fLanguage
English
Journal_Title
Selected Topics in Quantum Electronics, IEEE Journal of
Publisher
ieee
ISSN
1077-260X
Type
jour
DOI
10.1109/2944.488681
Filename
488681
Link To Document