Elastic properties measurement of glass layers fabricated on silicon wafers for microelectronics and micromachines

Author

Tsukahara, Yusuke ; Ohira, Katsumi ; Yanaka, Masa-aki ; Inaba, Masatoshi ; Satoh, Akinobu

Author_Institution

Tech. Res. Inst., Toppan Printing Co. Ltd., Saitama, Japan

Volume

42

Issue

3

fYear

1995

fDate

5/1/1995 12:00:00 AM

Firstpage

387

Lastpage

391

Abstract

Elastic properties such as the Young´s modulus, the Poisson´s ratio and the density of Si-B-O glass layers fabricated on [100] silicon substrates by the flame hydrolysis deposition method were measured. Thicknesses of the layers were about 20 /spl mu/m. It was found that the Young´s modulus decreased with the boron dopant concentration. The Poisson´s ratio was about 0.26 regardless of the boron dopant concentration. The measured elastic properties will be used in the design of micromachines fabricated with silicon substrates and glass layers.<>

Keywords

Poisson ratio; Young´s modulus; density; elastic moduli; glass; integrated circuit technology; micromechanical devices; small electric machines; spray coating techniques; Poisson ratio; Si; Si-B-O; Young modulus; [100] silicon substrates; boron dopant concentration; density; elastic properties; flame hydrolysis deposition; glass layers; microelectronics; micromachines; Acoustic measurements; Dielectric substrates; Fires; Frequency measurement; Glass; Microelectronics; Microscopy; Optical devices; Silicon; Ultrasonic variables measurement;

fLanguage

English

Journal_Title

Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on

Publisher

ieee

ISSN

0885-3010

Type

jour

DOI

10.1109/58.384447

Filename

384447