Automatic measurement system for degradation analysis in thin-film AlCu metallizations

Author

Catelani, Marcantonio ; Nicoletti, Riccardo

Author_Institution

Dipt. di Elettronica e Telecomunicazioni, Universita di Firenze, Florence, Italy

Volume

51

Issue

3

fYear

2002

fDate

6/1/2002 12:00:00 AM

Firstpage

401

Lastpage

407

Abstract

Microelectronic devices are required to have high reliability when subjected to stresses within the maximum ratings. Nevertheless, in multilayered integrated circuits (ICs) several degradation phenomena can generate failures. In this paper, the degradation process in thin-film AlCu metallizations by means of the thermal stress test is taken into account. To this aim, an automatic measurement system with programmable performances is designed and realized in order to induce thermal degradation and compute data. The measurement system can be easily replicated with simple equipment and user-friendly LabView software

Keywords

aluminium alloys; automatic test equipment; copper alloys; failure analysis; integrated circuit measurement; integrated circuit metallisation; integrated circuit reliability; thermal stresses; AlCu; AlCu thin film metallization; LabView software; automatic measurement system; degradation analysis; failure mechanism; microelectronic device; multilayered integrated circuit; programmable instrument; reliability; thermal stress test; Circuit testing; Integrated circuit measurements; Integrated circuit reliability; Metallization; Microelectronics; Performance evaluation; Thermal degradation; Thermal stresses; Thin film circuits; Transistors;

fLanguage

English

Journal_Title

Instrumentation and Measurement, IEEE Transactions on

Publisher

ieee

ISSN

0018-9456

Type

jour

DOI

10.1109/TIM.2002.1017707

Filename

1017707