C-4/CBGA comparison with other MLC single chip package alternatives

Author

Puttlitz, Karl J. ; Shutler, William F.

Author_Institution

IBM Microelectron, Hopewell Junction, NY, USA

Volume

18

Issue

2

fYear

1995

fDate

5/1/1995 12:00:00 AM

Firstpage

250

Lastpage

256

Abstract

Future applications, will require higher I/O counts, more densification, lower cost, and greater performance. This paper demonstrates why area-array based chip-to-substrate and substrate-to-card interconnections are strategic, particularly solder bump flip chips (SBFC or C-4) and ceramic ball or column grid arrays (CBGA/CCGA), respectively. That is, SBFC are capable of high pin counts coupled with high yields, performance, and reliability. Moreover, recently introduced CBGA/CCGA interconnections provide substantial benefits over standard pin grid array (PGA) packages. Also, CBGA/CCGA packages possess the highest density achievable at the card level when utilized in conjunction with SBFC-mounted die

Keywords

circuit optimisation; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit yield; C-4/CBGA; I/O counts; MLC single chip package; area-array based interconnections; card level; ceramic ball grid arrays; ceramic column grid arrays; chip-to-substrate interconnections; cost; densification; pin counts; reliability; solder bump flip chips; substrate-to-card interconnections; yields; Application specific integrated circuits; Bonding; Ceramics; Costs; Electronic components; Electronics packaging; Flip chip; Lead; Microelectronics; Wire;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.386257

Filename

386257