DocumentCode
784994
Title
A Fast Stroud-Based Collocation Method for Statistically Characterizing EMI/EMC Phenomena on Complex Platforms
Author
Bagci, Hakan ; Yucel, Abdulkadir C. ; Hesthaven, Jan S. ; Michielssen, Eric
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI
Volume
51
Issue
2
fYear
2009
fDate
5/1/2009 12:00:00 AM
Firstpage
301
Lastpage
311
Abstract
A fast stochastic collocation method for statistically characterizing electromagnetic interference and compatibility (EMI/EMC) phenomena on electrically large and loaded platforms is presented. Uncertainties in electromagnetic excitations and/or system geometries and configurations are parameterized in terms of random variables having normal or beta probability density functions. A fast time-domain integral-equation-based field-cable-circuit simulator is used to perform deterministic EMI/EMC simulations for excitations and/or system geometries and configurations specified by Stroud integration rules. Outputs of these simulations then are processed to compute averages and standard deviations of pertinent observables. The proposed Stroud-based collocation method requires far fewer deterministic simulations than Monte Carlo or tensor-product integrators. To demonstrate the accuracy, efficiency, and practicality of the proposed method, it is used to statistically characterize coupled voltages at the feed pins of cable-interconnected and shielded computer cards as well as the terminals of cables situated inside the bay of an airplane cockpit.
Keywords
Monte Carlo methods; avionics; electromagnetic compatibility; electromagnetic interference; integral equations; probability; stochastic processes; time-domain analysis; EMI/EMC phenomena; Monte Carlo method; Stroud-based collocation method; airplane cockpit; beta probability density function; electromagnetic compatibility; electromagnetic excitations; electromagnetic interference; field-cable-circuit simulator; stochastic collocation method; tensor-product integrators; time-domain integral-equation; Computational modeling; Electromagnetic compatibility; Electromagnetic compatibility and interference; Electromagnetic interference; Information geometry; Probability density function; Random variables; Solid modeling; Stochastic processes; Uncertainty; Electromagnetic coupling; Stroud integration rules; electromagnetic interference and compatibility (EMI/EMC); fast solvers; hybrid simulators; stochastic collocation; time-domain integral equations;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2009.2015056
Filename
4895360
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