Thermal displacement characteristics of a chip-on-suspension

A fundamental study on the temperature and slider displacement of a chip-on-suspension (COS) was performed. The results show that the temperature rise in the IC chip is almost proportional to the heating power and that the slider displacement in the tracking direction is almost proportional to the heating power applied to the chip. It takes several seconds for the temperature rise of the chip to saturate and the response of the slider displacement is less rapid than the temperature rise of the chip. The vibrational characteristics of the slider are not affected by the temperature rise.