• DocumentCode
    788134
  • Title

    Thick yttrium-iron-garnet (YIG) films produced by pulsed laser deposition (PLD) for integration applications

  • Author

    Buhay, H. ; Adam, J.D. ; Daniel, M.R. ; Doyle, N.J. ; Driver, M.C. ; Eldridge, G.W. ; Hanes, M.H. ; Messham, R.L. ; Sopira, M.M.

  • Author_Institution
    Sci. & Technol. Center, Westinghouse Electr. Corp., Pittsburgh, PA, USA
  • Volume
    31
  • Issue
    6
  • fYear
    1995
  • fDate
    11/1/1995 12:00:00 AM
  • Firstpage
    3832
  • Lastpage
    3834
  • Abstract
    High magnetic and dielectric quality, thick (50-100 μm), epitaxial, yttrium-iron-garnet (YIG) films were deposited at high rate by PLD. A two-step (low temperature deposition followed by rapid thermal anneal) low thermal budget PLD process was demonstrated suitable to deposit thick polycrystalline YIG films on metallized Si and GaAs. A modified PLD apparatus is used to deposit uniform, 80-100 μm, thick YIG films on 3-inch semiconductor wafers for integrated microwave circulator fabrication
  • Keywords
    garnets; magnetic epitaxial layers; magnetic microwave devices; microwave circulators; microwave integrated circuits; pulsed laser deposition; rapid thermal annealing; vapour phase epitaxial growth; yttrium compounds; 3 in; 50 to 100 mum; 80 to 100 mum; GaAs; PLD; Si; YFe5O12; YIG; YIG films; epitaxial YIG films; high dielectric quality; high magnetic quality; high rate deposition; integrated microwave circulator fabrication; integration applications; low temperature deposition; metallized GaAs; metallized Si; pulsed laser deposition; rapid thermal annealing; semiconductor wafers; thick polycrystalline YIG films; two-step low thermal budget PLD process; yttrium-iron-garnet films; Dielectrics; Magnetic films; Metallization; Optical pulses; Pulsed laser deposition; Rapid thermal annealing; Rapid thermal processing; Semiconductor films; Temperature; Yttrium;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.489787
  • Filename
    489787