• DocumentCode
    792133
  • Title

    Effect of film morphology on grain boundary segregation induced magnetic properties in heat treated CoCrPt/Cr films

  • Author

    Choe, G.

  • Author_Institution
    Dept. of Metall. Eng., Chonnam Nat. Univ., Kwangju, South Korea
  • Volume
    31
  • Issue
    6
  • fYear
    1995
  • fDate
    11/1/1995 12:00:00 AM
  • Firstpage
    2809
  • Lastpage
    2811
  • Abstract
    Effect of Co grain morphology on Cr segregation induced magnetic properties was investigated in heat treated CoCrPt/Cr thin films. In this work, interdiffusion and Cr segregation induced Co grain isolation were studied by post-deposition annealing of the CoCrPt films deposited on a Cr underlayer at different sputtering conditions. The films with voided boundaries showed a stronger heating temperature dependence of magnetic properties than the dense films, due to the promoted Cr segregation at the boundaries. TEM observation indicated that Cr was segregated from the Cr underlayer to the void boundaries of the CoCrPt films. The grain morphology of as-deposited films played an important role in Cr segregation during heat treatment, and the intergranular exchange decoupling was enhanced by the diffusion of Cr atoms into the voids isolating the Co grains
  • Keywords
    annealing; chemical interdiffusion; chromium; chromium alloys; cobalt alloys; exchange interactions (electron); ferromagnetic materials; grain boundary segregation; magnetic thin films; platinum alloys; sputtered coatings; transmission electron microscopy; voids (solid); CoCrPt films; CoCrPt-Cr; Cr underlayer; TEM; annealing; grain boundary segregation; grain isolation; grain morphology; heat treatment; interdiffusion; intergranular exchange decoupling; magnetic properties; sputtering; void boundaries; Annealing; Chromium; Grain boundaries; Heat treatment; Heating; Magnetic films; Magnetic properties; Morphology; Sputtering; Temperature dependence;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.490159
  • Filename
    490159