DocumentCode
79871
Title
Modeling of Surface Damage Mitigation in Fused Silica With Carbon Dioxide Laser
Author
Yu, Jeffrey Xu ; Xiang, X. ; Ji, H.N. ; Zu, X.T.
Author_Institution
Sch. of Phys. Electron., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume
24
Issue
5
fYear
2014
fDate
Oct. 2014
Firstpage
1
Lastpage
4
Abstract
A model of surface damage mitigation in fused silica irradiated by CO2 laser is built. Temperature distribution and surface morphology are simulated by finite-element method. It is proposed that a Gaussian crater appears in the mitigation site, which width and depth are dependent on the laser parameters. Following, the effects of frequency, duty cycle, and beam diameter on the size of mitigation are also analyzed. For the same laser power, reducing the above three parameters may lead to higher temperature at the spot center. However, the effects on the size of ablation and melting are inconsistent. The results show that a small laser beam is suitable for smaller and deeper defects, whereas a big laser beam is suitable for bigger and shallower defects. In addition, frequency and duty cycle have a significant influence on the ablation. Large duty cycle or high frequency may reduce the ablation, and thereby, the surface of the ablation profile becomes smoother after melted material recondense. Correspondingly, the mitigation process is mainly ablation for low duty cycle or low frequency.
Keywords
finite element analysis; high-frequency effects; laser beam effects; melting; silicon compounds; temperature distribution; Gaussian crater; SiO2; beam diameter effects; carbon dioxide laser; duty cycle; finite-element method; frequency effects; fused silica; laser parameters; laser power; melting; surface damage mitigation; surface morphology; temperature distribution; Laser ablation; Laser beams; Laser modes; Laser theory; Power lasers; Silicon compounds; Surface morphology; Damage mitigation; melting and ablation; temperature distribution;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2014.2334391
Filename
6848794
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